The 2024 Power Conversion and Intelligent Motion (PCIM) conference in Nuremberg, Germany, showcased cutting-edge advancements in power electronics. EEPower’s onsite coverage highlights innovations ranging from semiconductors to FETs, ICs, and wide-bandgap technologies. Here are the key developments from the event:
Power Integrations: High-Voltage ICs
Power Integrations introduced the BridgeSwitch2 IC family, targeting motor applications up to 746 W (1 HP). These integrated half-bridge motor-driver ICs include high- and low-side drivers and advanced FREDFETs with integrated lossless current sensing, achieving up to 99% inverter efficiency. The design reduces component count by 50% and PCB space by 30%, eliminating the need for shunt resistors and associated signal conditioning circuits. The ICs cover a range of applications, including heat exchanger fans, refrigerator compressors, and washing machine drums.
Cissoid: Onboard Inverter Reference Designs
Cissoid launched the compact EVK-PLA1060 series of On-Board Inverter Reference Designs, which are nearly production-ready for integration into vehicles. This design features a modular solution with a power module, control board, low ESL DC-link capacitor, compact EMC filter, and current sensors. Powered by Silicon Mobility’s OLEA T222 FPCU, the design accelerates response times and enhances functional safety, significantly reducing time-to-market for e-mobility applications.
Rhode & Schwarz: Isolated Probing System
Rhode & Schwarz previewed its next-generation R&S RT-ZISO isolated probing system, designed for high-voltage and fast-switching environments. The system features a power-over-fiber architecture providing galvanic isolation, ensuring high common mode rejection ratio up to 1 GHz. It compensates for thermal drifts and gain errors, offering superior signal fidelity.
Novosense: Automotive and Industrial Solutions
Novosense showcased its NSUC1610 motor driver SoC, integrating a Cortex M3 processor, MOSFET, and DAC into a single chip. This solution simplifies peripheral circuits and reduces system costs for automotive applications. Additionally, Novosense introduced a 16/24-channel driver IC for automotive LED applications, offering high integration, flexible dimming, and control capabilities.
WeEn Semiconductors: SiC MOSFETs, SBDs, and IGBTs
WeEn Semiconductors launched a range of SiC MOSFETs and SiC Schottky barrier diodes (SBDs) in TSPAK packages, suitable for EV charging, solar inverters, and high-power density PSUs. The company also showcased integrated SiC power modules in various configurations and thyristor/diode modules for industrial applications. WeEn’s IGBTs, available in 1200 V and 650 V variants, feature low leakage currents, excellent conduction, and switching performance.
Infineon Technologies AG: Power System Modeling
Infineon introduced power system reliability modeling, addressing the need for seamless operations in data centers and telecom infrastructures. This solution uses an algorithm on a digital power controller to enable real-time power supply health monitoring and lifetime estimation. Infineon also expanded its OptiMOS 7 MOSFETs portfolio, optimized for automotive and other transportation applications.
Vishay Intertechnology: SiC MOSFETs
Vishay Intertechnology exhibited its MaxSiC series of 1200 V silicon carbide MOSFETs, offering on-resistances of 55 mΩ, 95 mΩ, and 280 mΩ. These devices are suitable for traction inverters, photovoltaic energy conversion, onboard chargers, and charging station applications.
Conclusion
PCIM 2024 highlighted significant advancements in power electronics, showcasing innovations that promise to enhance efficiency, reliability, and performance across various applications. From high-voltage ICs and onboard inverter designs to isolated probing systems and SiC technologies, these developments are poised to drive the industry forward.