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Revasum Partners with SGSS to Develop Advanced Grinding Wheels for Silicon Carbide Wafers

by Anna

Revasum, a leading semiconductor manufacturing equipment provider, has joined forces with SGSS, a global high-performance materials and solutions specialist. This strategic partnership is dedicated to the creation of a novel range of grinding wheels tailored specifically for Silicon Carbide (SiC) wafers.

Leveraging Revasum’s extensive experience in semiconductor manufacturing equipment and SGSS’s state-of-the-art abrasive materials, this collaboration aims to pioneer a next-generation of surface finishing solutions. These solutions are set to establish new benchmarks in precision, efficiency, and surface quality within SiC wafer production, all while maintaining a strong focus on sustainability.

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The partnership bears significant potential for the semiconductor industry, presenting an opportunity to improve SiC wafer production processes. This, in turn, will drive advancements in power electronics, electric vehicles, renewable energy, and a range of other technology sectors.

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Revasum’s CEO, Scott Jewler, highlighted that this collaboration empowers them to provide customers with state-of-the-art tools and solutions to meet the growing demand for high-quality Silicon Carbide wafers.

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