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Samsung Electro-Mechanics Partners with AMD to Advance Substrate Technology

by Anna

Samsung Electro-Mechanics (SEMCO) has announced a strategic partnership with AMD to provide cutting-edge substrates for hyperscale data center compute applications. The substrates will be manufactured at SEMCO’s facilities in Busan, South Korea, and its newly established factory in Vietnam.

This collaboration is backed by SEMCO’s significant $1.3 billion investment in its Flip-Chip Ball Grid Array (FCBGA) factory, highlighting the company’s dedication to enhancing substrate technology and expanding its manufacturing capabilities to meet rigorous industry standards and future technological demands.

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The partnership with AMD is aimed at addressing the complex needs of integrating multiple semiconductor chips onto a single large substrate. The high-performance substrates required for CPU and GPU applications are notably larger and feature more layers than standard computer substrates. Specifically, data center substrates are approximately 10 times larger and possess three times more layers, which is crucial for providing efficient power delivery and maintaining signal integrity across advanced data centers.

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SEMCO’s innovative manufacturing processes address common challenges such as substrate warpage, ensuring high-quality yields during chip mounting. The FCBGA factory is equipped with state-of-the-art real-time data collection and modeling technologies. These advancements enable SEMCO to develop predictive manufacturing models that uphold signal, power, and mechanical integrity.

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This collaboration is set to advance the capabilities of data centers, aligning with the increasing demands for high-performance computing and data processing solutions.

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