Siemens has updated its Simcenter Flotherm software, part of the Xcelerator portfolio, to incorporate Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology. This enhancement enables semiconductor companies to create accurate and shareable 3D thermal analysis models of integrated circuits (IC) without exposing sensitive intellectual property (IP).
High-density chips generate significant heat, requiring thorough analysis and mitigation strategies for heat dissipation. While detailed thermal models can address these challenges, sharing such models across the electronic supply chain raises concerns about protecting critical details of chip architecture.
The Embeddable BCI-ROM technology in Simcenter Flotherm addresses these challenges by allowing IC designers to share accurate reduced-order thermal models of IC packages for 3D Computational Fluid Dynamics (CFD) thermal analysis. This technology compresses complex thermal models into a simplified form, enabling designers to embed the models in different thermal environments, predict temperature accurately, and iterate thermal solutions quickly.
Key Features and Advantages:
Security and Shareability: BCI-ROM technology allows semiconductor companies to securely share high-fidelity thermal simulation data across the electronics supply chain without revealing internal geometry and material properties of IC packages.
Reduced-Order Models: The technology creates reduced-order thermal models of IC packages, facilitating accurate temperature predictions in various thermal environments and systems.
Flexibility: Independent of specific boundary conditions, BCI-ROM technology offers flexibility in embedding models in different thermal environments.
Advancement Over Traditional Models: BCI-ROM is considered a substantial advancement over traditional modeling methods like the 2-Resistor and DELPHI models, offering accurate simulation of transient thermal behaviors and managing multiple heat sources in intricate IC packages.
Balance of Information Sharing and IP Protection: Siemens emphasizes the importance of a secure and collaborative method for sharing thermal management data in the face of increasing chip power density. Reduced-order models strike a balance between sharing vital thermal data for design and testing and protecting sensitive design details inherent in full models.
The updated Simcenter Flotherm software with Embeddable BCI-ROM technology addresses the critical need for effective IC thermal modeling while ensuring security, transparency, and collaboration within the electronic supply chain.